organic silicon electronic potting sealant SD9501

organic silicon electronic potting sealant SD9501

Model number :

sd9501

MOQ:

1pcs

Color:

transparent/white/black liquid

Package:

20kg/ set

Main characteristic:

ratio is 1:1, good elasticity after curing, waterproof and insulation

Main application:

electrical and electronic components, led junction box, wind power motor, pcb substrate etc.

Lead time:

within a week after payment

Model number :

sd9501

MOQ:

1pcs

Color:

transparent/white/black liquid

*Send an Inquiry to this supplier

Supplier Info.

Company Name： Huizhou SANDAO New Material Co., Ltd

Registration Date： 2004

Country / Region： guangdong / China

City： huizhou

Main Products： silicone rubber, silicone adhesive, ms adhesive

Product Detail

our product

Sandao organic silicon electronic potting sealant SD9501

Sandao organic silicon electronic potting sealant SD9501 is synthesis organo silicon electronic pouring sealant with high elasticity and high transparent for electronic component, packing divided to A and B two component, mixes the A and B two components and fully agitates before filling and sealing; The mixture has good fluidity, good elasticity after curing, excellent resistance to high and low temperature, excellent electrical performance, ozone resistance and atmospheric aging resistance, which is used for long-term outdoor use. The products are in full compliance with the requirements of the EU RoHS Directive.

Feature

◪ Resistance to high and low temperature -60~260℃
◪ Sandao organic silicon electronic pouring sealant with the advantages of automatic leveling, automatic remove air bubbles, high viscosity, high temperature resistance, moisture proof and waterproof insulation, easy rework, it can used as adhesive, sealing, waterproof, moisture-proof, mildew proof, dustproof, filling seal, shock absorption, aging resistance and so on.

Application

This potting sealant is fit for electrical and electronic components which required for waterproof and insulation, used for adhesive and sealing LED junction box, wind power motor, PCB substrate, etc., as well as various AC/DC power supply modules, control modules, automotive HID stabilizers, lights and various power control modules,etc.

DC power module bonding

LED junction box bonding

Wind energy motor bonding

Power module

PCB board bonding

Lamp part Bonding

product Performance

No.	Item			Standard	Standard	Standard
1	Before curing	Part A	appearance	transparent	black	white
2			viscosity(m Pa·S)	800～1000	800～1000	800～1000
3			density(g/cm3)	0.95～1.0	0.95～1.0	0.95～1.0
4		Part B	appearance	transparent	transparent	transparent
5			viscosity (m Pa·S)	50-150	50-150	50-150
6			density (g/cm3)	1.0-1.3	1.0-1.3	1.0-1.3
7	viscosity after mix(m Pa·S)			1000～1300	1000～1300	1000～1300
8	mix ratio			100:10	100:10	100:10
9	Operable time（min）			＜30	＜30	＜30
10	60℃ heating curing time（min）			30	30	30
11	Room temperature curing time（hr）			24	24	24
12	After curing	hardness（shore A,24hr）		30～50	30～50	30～50
13		tensile strength（MPa）		≥0.8	≥0.8	≥0.8
14		volume resistivity（Ω·cm）		≥1.0×10¹⁵	≥1.0×10¹⁵	≥1.0×10¹⁵
15		dielectric strength（kv/mm）		≥ 20	≥ 20	≥ 20
16		bake（80℃ 144h）		Not yellow	-	-

Kind remind: The above properties were measured at 25 ℃ and 55% RH for 7 days. The parameters provided in this data may vary depending on the environmental, temperature and humidity conditions;

Product details

Silicone electronic potting

SD9501 integrated silicone electronic potting Compound, high elasticity, high transparent Electronic components potting glue.

White/black viscous liquid

Good fluidity, good elasticity, excellent resistance to high and low temperature, excellent electrical performance.

Green environmental protection

Non-toxic and non-corrosive,The products fully comply with the requirements of EU RoHS standard

Iron bottle packaging

packing specification: 20kg/set ,component A/10kg .component B/10kg.

Use instructions

Caution

1. Mix the two components according to the weight ratio of A:B=1:1 and stir well, then remove air bubbles (vacuum or static) and then fill it up. Note: must stir evenly, otherwise affect the properties of solidified compounds; should be used within the applicable period of the sealant.
2. About mixing; After mixing component A and component B, manual or mechanical mixing can be adopted. When mixing, high temperature should be avoided because of high speed and long time agitation, so as to avoid shortening operation time and speeding up solidification, in case operate time is not enough. The surface of the product must be cleaned before it is sealed.
3. The work site and working environment must maintain the air circulation, in case the concentration is too high after the chemical liquid volatilize in the air, causes the staff to be sick (respiratory tract and skin irritation etc.).
4. The surface in contact with the compound must be cleaned. It is forbidden to mix the compound with organic compounds containing nitrogen, phosphorus, sulfur and heavy metal ions containing Sn,Ph,Hg, Bi, As , in case affect the curing of the compound.

Packaging and preservation

20kg/ set (component A 10kg and B 10kg), transported as non-dangerous goods, stored in a cool (room temperature) dry place, guarantee period is 6 months.

Contact

Supplier

Tell us your Buying Requirements