Epoxy resin pouring sealant is widely used in silicon steel materials, roller core materials, coil windings, capacitor bushing and other important radiating and high temperature resistance electronic appliances, such as transformers, motors, radiators, sensors, electromagnets, PCB plates, solenoid valves, air conditioners, power module, electromagnetic clutch, automobile parts, etc.
air conditioning
heat sink
Induction cooker bonding
PCB board bonding
Power module
Motor bonding
◪ Two-component 4:1 ratio, 100% solidification, no solvent, no pollution, no toxicity.
◪ Good weather resistance, water resistance, oil resistance, acid resistance, high temperature resistance, insulation, flame retardant, cracking resistance and so on.
◪ Can be cured at room temperature and heating, high bonding strength. Stable performance, good toughness and filling after curing, excellent physical, mechanical and insulation properties.
◪ It has low viscosity after mixing, no need of vacuum defoaming at room temperature, and long operating time, so it’s a kind of ideal pouring glue.
◪ For some larger parts of the pouring and sealing, can be one-time molding, more operational advantages.
◪ Achieve actually measured high thermal conductivity: 0.8w/m.k
| General performance | ||||
| Item | Condition | Part A | Part B | Mix liquid |
| Appearance | Visual | White/black Viscous liquid | Transparent / brown liquid | White/black liquid |
| Density | 25℃，g/cm3 | 1.64~1.65 | 1.11~1.13 | 1.59~1.61 |
| Viscosity | 25℃, mpa.s | 12000~13000 | 40~120 | 800~1000 |
Usage: 1.Mixing: mix part A and part B at 4:1 ratio by weight, potting after stir well. The operating time after mixing is 60 minutes at 25 ℃.
2.Solidification: at 25 ℃, it will harden at 6 for 8 hours, and at 80 ℃ for 1 hour. It can be assembled after hardening. Tests typically take place after 24 hours of curing.
Notes:This data is measured by the technicians in the laboratory, which has certain reference value for the users. However, because the usage methods and conditions of each user are different, it is suggested that the users should find out the best technology and method according to their own conditions.
| Feature after curing | ||
| Item | condition/unit | Test result |
| Hardness | Shore-D | >80 |
| Volume resistivity | 25℃，Ω.cm | 2.8*1015 |
| Breakdown voltage | 25℃,kv/mm | >30 |
| Dielectric constant | 25℃,1MHZ | 3.1±0.1 |
| Dielectric loss tangent | 25℃，1MHZ | <0.01 |
| Shear temperature range | Mpa | >10 |
| Operating temperature range | ℃ | -40~150 |
| Curing shrinkage | % | <0.5 |
Attention: 1, This kind of products are not dangerous goods, according to the general chemical storage and transportation, the storage period is 1 year.
2, A component should be stirred properly before use (as there will be precipitation after long period of time, it does not affect the performance after stir well,); after accurate weighing of component A and component B, please stir well and then use it.
3, The mixing amount of glue should not be too large, otherwise, the operating time will be shortened which lead to waste if cannot use out timely.
Notes:The above performance data are typical data of the product at humidity 70 ℃, temperature 25 ℃,for customer's reference only. Customers are kindly requested to use the measured data.
Contact
Supplier
