High multilayer anylayer HDI PCB stacked and stagged mircovias

High multilayer anylayer HDI PCB stacked and stagged mircovias

Name::

10 layer elic printed circuit board, any layer pcb fabrication

Material::

fr4

Board thickness::

1.6mm

Surface treatment::

immersion gold

Technology::

stack up n+n, min track/width 3/3mil, blind & buried vias, laser vias

Payment::

l/c,t/t,westernunion

Certification::

ul consumer (wear, electronic digital, household appliances, connectors)/industrial control/automobile ts16949/medical/server, cloud computing & base station/aviation/military/communication (certification in related applications)

Delivery Term：:

ddu, fob, cfa, cif, cpt, exw

Name::

10 layer elic printed circuit board, any layer pcb fabrication

Material::

fr4

Board thickness::

1.6mm

*Send an Inquiry to this supplier

Supplier Info.

Company Name： Rocket PCB Solution Ltd.

Registration Date： 2002

Country / Region： guangdong / China

City： dong guan

Main Products： PCB prototype,pcb fabrication,PCB maker

Product Detail

Anylayer/ ELIC (Every layer interconnection)

In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH) is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.

Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

......

ROCKET PCB Any Layer PCB （ELIC）process flow

Anylayer PCB DFM suggestion for layout

Product FEATURES

◪ Any Layer PCBs with laser vias and filled plating on each layer

◪ 0.4mm thin spacing CSP supported by Any layer interconnection

◪ Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices

ROCKET PCB STRENGTH

SPECIALIZED MANUFACTURING

Conductive materials and core-to-core bonding
Embedded components
RF connector attachment
Laser direct imaging (LDI)
Laser etching
Laser forming
Multi-level cavity construction
Plated cavities and edges
Composite/hybrid Structures
N+N dual press-fit
Dual-drill
Bonding on metal core
Bulid-up HDI
Long-short and staged gold finger

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control