Etching, also referred to as photochemical etching, refers to the removal of the protective film from the region to be etched by exposure and plate development, and the contact with the chemical solution during etching to achieve the effect of dissolution and corrosion, thereby forming the effect of unevenness or hollowing.
Etching needs to pay attention to:
1. Reduce side etching and sharp edges and increase the etching coefficient.
2. Improve the consistency of the etch rate between the board and the board.
3. Improve the uniformity of the etching rate of the entire surface of the board.
4. Improve the ability to safely handle and etch thin copper foil and thin laminates.
5. Reduce pollution.
