IC Substrate PCB IC PCB integrated circuit packaging PCB
IC substrates serve as the connection between IC chip(s) and the PCB through a conductive network of traces and holes. IC substrates are endowed with critical functions including circuit support and protection, heat dissipation, and signal and power distribution.
IC substrates represent the highest level of miniaturization in PCB manufacturing and share many similarities with semiconductor manufacturing. Rocket PCB produces many types of IC substrates on which IC chips are attached to the IC substrate utilizing wire bonding or flip chip methods.
Advanced technology that Rocket PCB adopts for the IC substrates manufacturing includes:
◪ CSP (Chip Scale Packages)
◪ FC-CSP (Flip Chip) CSP
◪ COB (Chip on Board)
◪ PoP (Package on Package)
◪ COB (Chip on Board)
◪ PiP (Package in Package)
◪ SiP (System in Package)
◪ RF Module
◪ LED Package
Product application
Contact
Supplier
